Apparatus for earthing of chuck

专利摘要:
PURPOSE: An apparatus for earthing of chuck is provided to prevent a chuck connection line from being short-circuited and to stabilize the apparatus for earthing of chuck with respect to heat, by making a main connection line protected by an elastic spring. CONSTITUTION: The chuck connection line is connected to a chuck. A connection terminal fixes the chuck connection line. The main connection line is connected to the chuck connection line. The first connection tab connects the chuck connection line with the main connection line. The elastic spring surrounds the main connection line. A ground line is connected to the main connection line. The second connection tab connects the main connection line with the ground line. A ground part grounds the ground line.
公开号:KR20020095730A
申请号:KR1020010033913
申请日:2001-06-15
公开日:2002-12-28
发明作者:박영철
申请人:삼성전자 주식회사；
IPC主号:

专利说明:

Grounding device of chuck {Apparatus for earthing of chuck}
[11] TECHNICAL FIELD The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a grounding apparatus of a chuck.
[12] A chuck for seating a wafer and performing a predetermined process is essential for the manufacturing process of a semiconductor device. On the other hand, the chuck is grounded to prevent electrical errors that may occur in the chuck during the process or measurement.
[13] Hereinafter, a grounding device of a general chuck will be described with reference to the accompanying drawings. 1 is a cross-sectional view as seen from above to illustrate a grounding device of a general chuck.
[14] Referring to FIG. 1, the grounding device of the chuck includes a chuck connecting line 24 connected to a chuck 20 installed on the chuck support 10, a connecting terminal 22 fixing the chuck connecting line 24, and a chuck connecting line ( The main connecting line 36 connected to the 24, the first connecting tab 26 coupling the chuck connecting line 24 and the main connecting line 36, the grounding line 40 connected to the main connecting line 36, and the main connecting line A second connection tab 38 for coupling the 36 and the ground line 40 to each other, and a ground portion 42 for grounding the ground line 40 are provided. Here, reference numeral 28 is a tab connecting line connecting the main connecting line 36 with the first connecting tab 26, reference numeral 32 is a fixing ring for stabilizing the end of the main connecting line 36 and 30 is the main connecting line 36 ) And a tab connected to the tab connecting line 28.
[15] On the other hand, the chuck 20 has a large number of movements on the chuck support 10 during the process. With this movement of the chuck 20, the grounding device for grounding the chuck also moves together. However, the chuck connecting line 24 is shorted with the movement. Enumerating the problems caused by the short circuit of the chuck connecting line 24, the first chuck connecting line 24 is short-circuited to rise up, causing misalignment of the wafer seated on the chuck 20. Second, an error occurs in the vacuum that presses the wafer and the wafer falls down. As a result, the wafer may break and damage peripherals, such as probe card loading units. Third, there is a frequent case that an error occurs due to a measurement failure when measuring the state of the wafer by the probe card due to an increase in the electrical resistance (Ω) of the chuck 20.
[16] In addition, there is a problem that the chuck grounding device is weak in the heat applied during the process.
[17] Accordingly, the technical problem to be achieved by the present invention is to provide a chuck grounding device that is stable to heat without the short circuit of the chuck connection line.
[1] 1 is a cross-sectional view seen from above to explain a grounding device of a general chuck.
[2] Figure 2 is a cross-sectional view seen from the side to explain the grounding device of the chuck according to the present invention.
[3] * Explanation of symbols for main parts of the drawings
[4] 100; Chuck 102; Connector
[5] 104; Chuck connecting line 106; First Connection Tab
[6] 108; Tap connector 110; Fixed tab
[7] 112; Retaining ring 114; spring
[8] 116; Main connection line 118; covering
[9] 120; Second connection tab 122; Ground wire
[10] 124; Ground
[18] The grounding apparatus of the chuck according to the present invention for achieving the technical problem, in the method of grounding the chuck on which the wafer is seated, a chuck connecting line connected to the chuck, a connecting terminal for fixing the chuck connecting line, the chuck connecting line A first connection tab coupled to the main connection line, a first connection tab coupling the chuck connection line and the main connection line, a spring having an elastic force surrounding the main connection line, a ground line connected to the main connection line, and a first connection line connecting the main connection line and the ground line; 2 is provided with a connection tab and a ground portion for grounding the ground wire.
[19] In the grounding apparatus of the chuck according to the present invention, it is preferable that the main connecting wire is a double coated sheathed wire, and the covering of the coated wire is preferably a non-flammable material.
[20] In the grounding device of the chuck according to the invention, the diameter of the spring is preferably 3.5mm to 5.0mm, the first connecting tab and the second connecting tab can be double, and the shape of the connecting terminal is 3 It is preferable that it is a polygon which has an angle from eight angles.
[21] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. The present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, only this embodiment to make the disclosure of the present invention complete, and complete the scope of the invention to those skilled in the art It is provided to inform you.
[22] Figure 2 is a cross-sectional view seen from the side to explain the grounding device of the chuck according to the present invention.
[23] Referring to FIG. 2, the grounding device of the chuck includes a chuck connecting line 104 connected to the chuck 100, a connecting terminal 102 fixing the chuck connecting line 104, and a main connecting line connected to the chuck connecting line 104. 116, the first connecting tab 106 coupling the chuck connecting line 104 and the main connecting line 116, a spring 114 having elastic force surrounding the main connecting line 116, and connected to the main connecting line 116. The ground line 122 includes a ground line 122, a second connection tab 120 coupling the main connection line 116 and the ground line 122, and a ground portion 124 to ground the ground line 122. The tab connection line 108 is connected between the first connection tab 106 and the second connection tab 120 and the main connection line 116. In addition, the end of the main connecting line 116 is further provided with a fixing tab 110 for coupling the tab connecting line 108 and the fixing ring 112 for stabilizing the main connecting line 116.
[24] In this case, the main connecting wire 116 is preferably a double coated sheathed wire 118, it is preferable that the covering 118 forming a coated wire is a non-combustible material. Because the manufacturing process of the semiconductor device mainly proceeds at a high temperature, it is to protect the main connection line 116 from the heat generated at this time. Since the main connection line 116 must be accompanied by the movement of the chuck 100, it must have fluidity by appropriate elastic force. Therefore, the sheath 118 surrounding the main connecting line 116 is a material having an appropriate elastic force.
[25] In addition, the spring 114 used in the embodiment of the present invention is a material having elastic force surrounding the main connecting line 116. The diameter of the spring 114 may be set to 3.5 mm to 5.0 mm in consideration of appropriate elastic force.
[26] Meanwhile, the first connection tab 106 and the second connection tab 120 are doubled. This is to prevent the tap connecting line 108 from falling off and to ensure contact of the chuck connecting line 104. If the tab is double, it serves to double the tab connecting line (108).
[27] Further, the shape of the connection terminal 102 is a polygon having a three to eight angles. If the shape of the connection terminal 102 is a polygon, the chuck connecting line 104 can be easily attached to and detached from the chuck 100.
[28] Although the present invention has been described in detail above, the present invention is not limited to the above embodiments, and many modifications and improvements can be made by those skilled in the art.
[29] According to the grounding device of the chuck according to the present invention described above, the main connecting wire is protected by a spring having an elastic force so that the chuck connecting wire is not shorted and a strong coating on the heat can provide a stable chuck grounding device.

权利要求:
Claims (6)
[1" claim-type="Currently amended] In the method of grounding the chuck on which the wafer is seated,
A chuck connecting line connected to the chuck;
A connection terminal for fixing the chuck connection line;
A main connection line connected to the chuck connection line;
A first connection tab coupling the chuck connection line and the main connection line;
A spring having an elastic force surrounding the main connection line;
A ground line connected to the main connection line;
A second connection tab coupling the main connection line and the ground line; And
The grounding device of the chuck characterized in that it comprises a grounding portion for grounding the ground wire.
[2" claim-type="Currently amended] The method of claim 1,
The main connecting line is a chuck grounding device, characterized in that the double coated sheathed wire.
[3" claim-type="Currently amended] The method of claim 2,
The cladding wire forming the cladding wire is a non-flammable material, characterized in that the grounding device of the chuck.
[4" claim-type="Currently amended] The method of claim 1,
The diameter of the spring is a grounding device of the chuck, characterized in that 3.5mm to 5.0mm.
[5" claim-type="Currently amended] The method of claim 1,
The first connection tab and the second connection tab is a grounding device of the chuck, characterized in that consisting of a double.
[6" claim-type="Currently amended] The method of claim 1,
The connection terminal is a grounding device of the chuck, characterized in that the polygon having a three to eight angles.

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同族专利:

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引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2001-06-15|Application filed by 삼성전자 주식회사

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2001-06-15|Priority to KR1020010033913A

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2002-12-28|Publication of KR20020095730A

优先权:

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申请号 | 申请日 | 专利标题

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KR1020010033913A|KR20020095730A|2001-06-15|2001-06-15|Apparatus for earthing of chuck|